Capability Roadmap
Traditional PCB - 1
 |
2020
Standard
|
2020
Advanced
|
2021 | 2022 | |
|
Line Width/Space (um): |
50/50 | 40/40 | 40/40 | 35/35 | |
|
Pattern Position Tolerance (um): |
+/-30 | +/-25 | +/-25 | +/-20 | |
|
Impedance Tolerance: |
+/-8% | +/-5% | +/-5% | +/-4% | |
|
Maximum Layer Count:
(Traditional & HDI)
|
26L | 30L | 30L | 36L | |
|
Routing Tolerance:
(um)
|
+/-75 | +/-50 | +/-50 | +/-35 | |
|
Finished Board Thickness:
(mm)
|
0.2~3.5 | 0.15~4.0 | 0.15~4.0 | 0.1~4.0 | |
|
Board Thickness
Tolerance (mm)
|
Thickness
> 0.5mm:
|
+/-10% | +/-8% | +/-8% | +/-6% |
|
Thickness
≤ 0.5mm:
|
+/-0.05 | +/-0.03 | +/-0.03 | +/-0.03 | |
Traditional PCB - 2
 |
2020
Standard
|
2020
Advanced
|
2021 | 2022 | |
| Min. Mechanical Drill Size(um): | 100 | 75 | 75 | 75 | |
| Hole To Hole Accuracy(um): | +/-50 | +/-50 | +/-50 | +/-38 | |
|
Max.
Aspect Ratio
(Through-hole):
|
0.1≤ Dia. < 0.2mm: | 6:1 | 8:1 | 8:1 | 8:1 |
| 0.2≤ Dia.< 0.3mm: | 10:1 | 12:1 | 16:1 | 18:1 | |
| 0.3mm ≤ Dia.: | 11:1 | 15:1 | 18:1 | 20:1 | |
|
Through Hole
Size Tolerance
(um):
|
NPTH: | +/-50 | +/-25 | +/-38 | +/-25 |
| PTH: | +/-75 | +/-50 | +/-50 | +/-38 | |
| Press Fit Hole: | +/-50 | +/-38 | +/-38 | +/-38 | |
|
Mechanical
Blind Hole:
|
Min. Hole Size:
(um)
|
200 | 150 | 150 | 100 |
|
Hole Size Tolerance:
(um)
|
+/-75 | +/-50 | +/-50 | +/-38 | |
|
Depth Precision:
(um)
|
+/-50 | +/-25 | +/-38 | +/-25 | |
| Max. Aspect Ratio: | 0.8:1 | 1:1 | 0.9:1 | 1:1 | |
HDI
 |
2020
Standard
|
2020
Advanced
|
2021 | 2022 |
| Maximum Layer count of Any-layer: | 14L | 16L | 16L | 18L |
| Minimum Blind via size(mm): | 0.075 | 0.075 | 0.075 | 0.075 |
| Max Blind Via Aspect Ratio: | 0.7:1 | 0.8:1 | 0.8:1 | 1:1 |
| Min Blind via Capture pad(mm): | Dia.+0.15 | Dia.+0.1 | Dia.+0.13 | Dia.+0.1 |
| Min Blind via Target Pad(mm): | Dia.+0.15 | Dia.+0.1 | Dia.+0.13 | Dia.+0.1 |
| Filling via dimple value(um): | ≤15 | ≤10 | ≤10 | ≤10 |
| Maximum lamination times: | 6 | 7 | 7 | 8 |
Rigid-flex1
| Item | Flex - Rigid | Regal | Semi-Flex |
| Figure |
 |
 |
 |
| Flexible Material | Polyimide |
FR4 + Coverlay
(Polyimide)
|
FR4 |
| Flexible thickness |
0.025~0.1mm
(Exclude copper)
|
0.05~0.1mm
(Exclude copper)
|
Remained
Thickness:
0.25+/-0.05mm
(Dedicated
Material: EM825(I))
|
| Bending angle | Max 180° | Max 180° |
Max 180°
(Flex layer≤2)
Max 90°
(Flex layer>2)
|
|
Flexural Endurance
IPC-TM-650,
Method 2.4.3.
|
<1000 cycle | < 25 cycle | NA |
|
Bending Test
1) Mandrel diam:
6.25mm
|
<10K cycle
(Bending Angle:180°)
|
<500 cycle
(Bending Angle:180°)
|
<10 cycle
(Bending Angle:180°)
|
| Application |
Flex to install &
Dynamic(Single side)
|
Flex to install | Flex to install |
Rigid-flex2
 |
2020
Standard
|
2020
Advanced
|
2021 | 2022 |
| Line Width/Space on Flex Core(um): | 60/60 | 50/50 | 50/50 | 40/40 |
| Impedance Tolerance on Flex Layer: | +/-8% | +/-5% | +/-5% | +/-4% |
| Flex Core Thickness (Exclude copper) (um): | 25 | 25 | 20 | 12.5 |
| Maximum Flex Layer Count: | 6L | 8L | 8L | 8L |
| Flex outline tolerance(um): | +/-100 | +/-50 | +/-75 | +/-50 |
| Flex outline to Pattern tolerance (um): | ±100 | ±50 | ±75 | ±50 |
| Finished Flex Board Thickness (mm): | 0.075~0.25 | 0.075~0.3 | 0.075~0.3 | 0.075~0.3 |