The following table lists the our China factory (suzhou, wuxi, jiangsu) of process capability
Capability | Current | Future | |||||
Suzhou | Wuxi | Jiangsu | Suzhou | Wuxi | Jiangsu | ||
Plant Capacity
(Kilo SF/Month)
|
800K | 850K | 1200K | 800K | 900K | 1500K | |
Layer Count (Layer) | 2 ~ 14 | 2 ~ 26 | 2 ~ 26 | 2 ~ 20 | 30 | 30 | |
Line Width/Spacing
(mm)
|
0.1/0.1 | 0.05/0.05 | 0.05/0.05 | 0.1/0.1 | 0.04/0.04 | 0.04/0.04 | |
Drill Size (mm) | |||||||
Mechanical size Min
(mm)
|
0.2 | 0.1 | 0.1 | 0.2 | 0.075 | 0.075 | |
Laser size (mm) | N/A | 0.075 | 0.075 | N/A | 0.05 | 0.05 | |
Electrical Test Pitch
(mm)
|
0.4 | 0.2 | 0.2 | 0.4 | 0.2 | 0.2 | |
Board thickness (mm) | |||||||
Min
Thickness
|
2L | 0.5 | 0.15 | 0.15 | 0.5 | 0.1 | 0.1 |
4L | 0.5 | 0.25 | 0.25 | 0.5 | 0.2 | 0.2 | |
Board Finishing | |||||||
OSP | ● | ● | Produced in Wuxi | ● | ● | Produced in Wuxi | |
ENIG | ● | ● | Produced in Wuxi | ● | ● | Produced in Wuxi | |
Selective ENIG | ● | ● | Produced in Wuxi | ● | ● | Produced in Wuxi | |
ENEPIG | Produced in Wuxi | ● | Produced in Wuxi | Produced in Wuxi | ● | Produced in Wuxi | |
Hard gold | Produced in Wuxi | ● | Produced in Wuxi | Produced in Wuxi | ● | Produced in Wuxi | |
Soft gold | Produced in Wuxi | ● | Produced in Wuxi | Produced in Wuxi | ● | Produced in Wuxi | |
Immersion Tin | ● | ● | Produced in Wuxi | ● | ● | Produced in Wuxi | |
Immersion silver | ● | ● | Produced in Wuxi | ● | ● | Produced in Wuxi | |
HASL & Lead
free HASL
|
Sub-contract | Sub-contract | Sub-contract | Sub-contract | Sub-contract | Sub-contract | |
Material | |||||||
FR4
(Leed-Free / Halogen-Free / Middle-Tg / High-Tg)
|
● | ● | ● | ● | ● | ● | |
BT | ○ | ● | ● | ○ | ● | ● | |
High Speed & High Frequency | ○ | ● | ● | ○ | ● | ● | |
High Thermal Conductive / IMS | ● | ○ | ○ | ● | ○ | ○ | |
Polymide | ○ | ● | ● | ○ | ● | ● | |
EMI | ○ | ● | ● | ○ | ● | ● | |
Special Process/Product | |||||||
HDI | ○ | ● | ● | ○ | ● | ● | |
Rigid-Flex | ○ | ● | ● | ○ | ● | ● | |
Semi-Flex | ● | ○ | ○ | ● | ○ | ○ | |
Heavy Copper | ○ | ● | ○ | ○ | ● | ○ | |
Back Drill | ○ | ● | ● | ○ | ● | ● | |
High Speed / High Frequency | ○ | ● | ● | ○ | ● | ● | |
High Layer Count | ○ | ● | ○ | ○ | ● | ○ | |
LED/ CMOS | ○ | ● | ● | ○ | ● | ● | |
High Thermal Conductive | ● | ● | ○ | ● | ● | ○ | |
Copper Inlay | ○ | ● | ○ | ○ | ● | ● |
Comment: ●HAVE ○HAVE NOT